School of Microelectronics, SUSTech，Associate Professor Fengwei An's Research Group Wins Best Paper Award at IEEE ICTA 2024

2024-12-03 Research News views：8

From October 25 to 27, 2024, the IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA 2024) was grandly held in Hangzhou, China. The paper titled "High-resolution Stereo-vision Depth Processor with Min-pooling Method" from Associate Professor Fengwei An's research group at the School of Microelectronics, Southern University of Science and Technology (SUSTech), was successfully accepted by the conference and won the Best Paper Award, with an award rate of approximately 5%. Relevant work from Tsinghua University, Zhejiang University, University of Science and Technology of China, and Sun Yat-sen University also received this honor. The first author of this paper is Zhang Wenyue, a 2022 Ph.D. student at the School.

Figure 1: Comparison between the proposed novel architecture (B) and the conventional architecture (A)

This paper focuses on the design of a high-resolution stereo-vision depth processor. High-resolution stereo-vision depth processors have been widely adopted due to their cost-effectiveness and high information density. However, as resolution increases, hardware performance demands grow significantly. To address this challenge, the paper proposes a Semi-Global Matching (SGM) method combined with min-pooling, effectively reducing memory usage by 50%. This optimization not only minimizes memory resource consumption but also demonstrates excellent performance in both FPGA and ASIC implementations. This work was supported by the Shenzhen Science and Technology Innovation Commission's Major Science and Technology Program.

Figure 2: Best Paper Award certificate

ICTA 2024 was co-hosted by the Hangzhou International Innovation Center (HIIC) of Zhejiang University and the School of Integrated Circuits at Zhejiang University. Distinguished guests including Wu Hanming, Academician of the Chinese Academy of Engineering (CAE) and Chief Scientist of HIIC; Liu Sheng, Academician of the Chinese Academy of Sciences (CAS); and Yang Jianyi, Director of HIIC, attended the conference. With the theme "Chiplet and Future IDM," the conference brought together renowned experts, university faculty and students, and industry professionals from both domestic and international backgrounds. Participants engaged in in-depth exchanges and discussions on cutting-edge integrated circuit technologies, including high-speed SerDes, optical communication chips, AI processor chips, power management chips, sensing and imaging chips, Internet of Things (IoT) chips, millimeter-wave chips, and biosensing chips, showcasing the latest technological achievements in the field of integrated circuits.