Research Directions

1IC Design Methodology

Introduction to research direction: It focuses on the research of IC design methodology, IC simulation, physical design automation technology, as well as corresponding development tools and system design platform. The EDA platform of the school is available now. Click the link to learn more:https://sme.sustech.edu.cn/index/news/neiye/id/387.html

Teachers of the Research: Yu Hao, Zhou Shengming, Chen Quan

2AI Chips

Introduction to research direction: It focuses on the research of IC design of high-performance AI, communication and sensing. It has been granted as the Engineering Research Center on Future Communication IC sponsored by the Ministry of Education, the key R & D plan of the Ministry of Science and Technology, and a member of Peacock Team of Shenzhen. The main goal is to solve the chip design bottleneck technology, form a series of self-developed IP and talent training, and take the international leading position.

Teachers of the Research: Yu Hao, Liu Xiaoguang, An Fengwei, Zhan Chenchang, Pan Quan, Gao Yuan, Lin Longyang, Fang Xiaohu, Liu Xiaolong, Li Jiamin, Mao Wei

3IC Manufacturing and Process

Introduction to research direction: Facing the device demands of the era of More than Moore, research new materials, new devices and new processes, focus on key directions such as wide band gap semiconductors and memory-computing integrated devices.

Teachers of the Research: Yu Hongyu, Ye Huaiyu, Li Xiexi, Li Yida, Zhou Feichi, Chen Kai, Wang Qing

4Micro-Nano System and Integration

Introduction to research direction: Introduction to research direction: Research on post Moore IC packaging technology, system packaging technology, wafer-level packaging technology, 3D heterogeneous integration method, micro-nano system design, micro-assembly and verification testing. It has been granted as Guangdong 3D Integration Engineering Research Center. The Center closely adheres to the major demands of the country and the development of IC industry, carries out near industrial R & D around 3D integration, and carries out technical pre-research and talent reserve for Shenzhen Chip Laboratory (Preparatory).

Teachers of the Research: Wang Fei, Li Yi, Ye Huaiyu, Li Xiexi, Li Yida, Wang Min, Lin Yuanjing, Zhang Guobiao, Zhu Yuan