Research Centers 

1Research Center on IC Design Methodology and EDA(Public EDA Design Platform)

At the uppermost industry in the semiconductor industry, the EDA industry is the foundation for the development of IC industry. Currently, above 90% of EDA tools used by China's IC enterprises come from abroad, and the core EDA technologies and products are not in our hands. As China's specially arranged key EDA projects of core electronic devices, high-end general chips and basic software products have been settled in Shenzhen, autonomous, controllable EDA innovation supporting platforms have been set up for 6000 talents in demand in a decade. To cooperate with internationally renowned companies like Synopsys and domestic manufacturers such as Empyrean and Hongxin Micro-nano, the School will carry out research on IC design methodology, improve EDA tool processes, and take active part in the national plan to address the "stranglehold" issue. This is how we can independently build our own EDA tools. The SME will bring homemade IC EDA tool platforms to its campus, and build IC industry-teaching incorporated innovation platforms via cooperation with enterprises. It will establish laboratories in the fields of IC design methodology and EDA on a cooperative basis to enrich the resources of the EDA research center. It will build a public design platform for teaching and scientific research (a university program), covering various design processes and design methods including Digital ASIC, Mixed-Signal IC, Analog IC, RF IC, 3.5-generation dedicated EDA, and SoC characterized by energy-efficient design, Design for Manufacturability (DFM) and Design for Testability (DFT), etc. The platform will formulate a long-term and sustainable software and hardware improvement and upgrade plan to attract world-renowned manufacturers such as Cadence, Synopsys, Mentor Graphics, and domestic manufacturers including Empyrean and Hongxin Micro-Nano to provide discounted EDA software packages for university programs (charging only 0.1% of the price of commercial versions). It will strive to maximize the number of licenses by over 100, provide technical services and training in design, and hold the world's most cutting-edge technical exchange events. The platform will adopt advanced technical means and management modes to ensure the security and technical confidentiality of design data, respect and protect intellectual property rights, and follow international intellectual property rules, so as to create a favorable environment for scientific research and teaching.

Members of the Research Center: Zhou Shengming, Yu Hao, An Fengwei, Pan Quan, Chen Quan, Zhan Chenchang, Gao Yuan, and Yang Junyi

2Research Center on High-performance System-on-chip ICs

The Research Center on High-Performance System-on-Chip ICs is oriented to the research of 5G medium-to-high frequency IC design and artificial intelligence IC design. Objectives of the Research Center: In 5G medium-to-high frequency IC design, the goal is to implement 5G millimeter wave small base stations and their core communication devices and chips (PA, LNA, Switch, ADC, etc.). The team has developed the first domestic millimeter-wave band 26GHz GaN power amplifier, and undertaken Huawei 6G communication projects such as the IC core module for 140GHz communication. In artificial intelligence IC design, the goal is to implement low power consumption mW curable vision edge smart chips, which will deliver a deep learning processing algorithm that can be used at edge, and achieve real-time TOPs-level processing throughput. The team has developed the world leading 3D multi-core chip with deep compression algorithm that can achieve storage and computing at the same time, and lent successful support to the projects of Huawei, DJI and Tencent.

Research Center Members: Yu Hao, An Fengwei, Zhan Chenchang, Pan Quan, Chen Quan, and Gao Yuan

3Research Center on Wide Band Gap Semiconductor

On March 31th, 2018, with the strong support of the municipal party committee and municipal government of Shenzhen and the joint efforts of Southern University of Science and Technology, China Advanced Semiconductor Industry Innovation Alliance (CASA) and other institutions, the Shenzhen Institute of Wide-Bandgap Semiconductors was officially launched. The Shenzhen Institute of Wide-Bandgap Semiconductors has become a center for technological innovation of third-generation semiconductors of both Shenzhen and Guangdong Province, and it is driving the technological innovation of third-generation semiconductors forward for the whole China. The SME will make full use of the resources within this platform and carry out close cooperation with Shenzhen Institute of Wide-Bandgap Semiconductors to build the Research Center of Wide Bandgap Semiconductors. The "transdisciplinary and cross-institute" system will apply to top talents in core technologies of Shenzhen Institute of Wide-Bandgap Semiconductors and the Research Center of Wide Band Gap Semiconductors. Research directions of the Center include: multiscale multi-physical field simulation design, wide bandgap chips, novel sensors in severe environments, SiP advanced packaging, high-power chip packaging, and advanced packaging materials.

Research Center Member: Yu Hongyu, Ye Huaiyu, Wu Yifeng, Guo Yuejin, Wang Qing et al.

4Research Center on Microsystems and Applications

 Research directions of the Center include: micrometer/nanometer processing, physical and chemical sensors, biochips and medical sensors, chip laboratories, and brain chips.

Research Center Members: Wang Fei, Cui Dehu, Li Yi, Wang Min, Jaewon, PARK, Zhao Changhui, and RAM RAJENDRAN