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李毅达

助理教授
个人简介

个人主页

李毅达博士于2013年获得新加坡国立大学Integrative Science and Engineering的博士学位。2014 – 2016年被受邀到半导体公司台积电担任主任工程师一职,参与研发了7/5 nm的先进的半导体芯片制程。2016-2020年,他担任新加坡国立大学资深博士后研究员,同时负责4个研究项目,并带领超过20个研究员。2020 年 9月份加入南方科技大学深港微电子学院。
李毅达博士已发表SCI/EI论文26篇包括在Nat Comms, ACS Nano, Nanoscale, Nano Energy, Advance Electronics Materials 等期刊,和IEEE VLSI 等会议,其中55%以上是第一作者或通讯作者。其中在VLSI报告的柔性三五半导体光传导器的工作还被知名的Compound Semiconductor 网页杂志上报导 (https://compoundsemiconductor.net/article/105341/Showcasing_The_Compounds_At_VLSI/feature)。另外,他在国际知名会议中Graphene Flagship 2019 和VLSID 2020受邀报告2次. 授权发明专利7项。
招聘信息
李毅达博士课题组常年招聘博士后、科研助理,招收博士生、硕士生、本科实习生,有意应聘者请将简历(格式PDF)发送至李毅达邮箱,以“招聘岗位_应聘者姓名”为题。
联系方式:liyd3@sustech.edu.cn
教育经历

2013年,新加坡国立大学,博士学位
2009年,新加坡国立大学,学士学位

工作经历

2020年9月-至今,南方科技大学,助理教授
2016年9月-2019年9月,新加坡国立大学,资深博士后研究员
2014年8月-2016年9月,台积电,主任工程师
2013年11月-2014年8月,新加坡国立大学,博士后研究员

研究简介

新型半导体材料器件(逻辑和存储)的制程,理论,内存计算系统的整合和利用柔性材料和传统电子来创造新一代的可穿戴设备。

所获荣誉

2020 Microwave and Wireless Components Letters Tatsuo Itoh Prize of the IEEE Microwave Theory and Techniques Society (MTT-S)
Invited talk, International Conference on VLSI Design, Bangalore, 2020
Invited talk, Graphene Flagship, Helsinki, Finland, 2019
Featured paper at Compound Semiconductor (VLSI 2018, Honolulu, USA) - https://compoundsemiconductor.net/article/105341/Showcasing_The_Compounds_At_VLSI/feature
Bachelor Degree with First Class Honors in Electrical and Computer Engineering, National University of Singapore, 2009

代表文章

1. Y. Li, X. Feng, M. Sivan, J. F. Leong, B. Tang, X. Wang, J. N. Tey, J. Wei, K. W. Ang and A. V. Y. Thean, Aerosol Jet Printed WSe2 Crossbar Architecture Device on Kapton with Dual Functionality as Resistive Memory and Photosensor for Flexible System Integration, IEEE Sensors, vol. 20, no. 9, pp. 4653-4659, May 2020
2. J. Pan, Y. Luo, Y. Li*, C. Tham, C. Heng and A. V. Thean, "A Wireless Multi-Channel Capacitive Sensor System for Efficient Glove-based Gesture Recognition with AI at the Edge," in IEEE Transactions on Circuits and Systems II: Express Briefs, DOI: 10.1109/TCSII.2020.3010318. *co-first (Early Access)
3. Yuxuan Luo, Yida Li, Aaron Voon-Yew Thean, Chun-Huat Heng, “A 70μW 1.19mm2 Wireless Sensor with 32 Channels of Resistive and Capacitive Sensors and Edge-Encoded PWM UWB Transceiver”, 2020 IEEE International Solid-State Circuits Conference, pp. 346-348, 2020
4. B. Xiong, Y. Li, A. V. Thean and C. Heng, "A 7 x 7 x 2 mm3 8.6- µW 500-kb/s Transmitter With Robust Injection-Locking-Based Frequency-to-Amplitude Conversion Receiver Targeting for Implantable Applications," in IEEE Journal of Solid-State Circuits, vol. 55, no. 6, pp. 1698-1708, June 2020
5. Y. Luo, Y. Li, A. V. Thean and C. Heng, "An 8.2- µW 0.14-mm2 16-Channel CDMA-Like Capacitance-to-Digital Converter," in IEEE Journal of Solid-State Circuits, vol. 55, no. 5, pp. 1361-1373, May 2020
6. Maheswari Sivan, Yida Li*, Hasita Veluri, Yunshan Zhao, Tang Baoshan, Xinghua Wang, Evgeny Zamburg, Jin Feng Leong, Jessie Xuhua Niu, Umesh Chand & Aaron Voon-Yew Thean*, All WSe2 1T1R resistive RAM cell for future monolithic 3D embedded memory integration, Nat Comms, 10, 5201, November 2019
7. Y. Li, A. Alian, M. Sivan, L. Huang, K.-W. Ang, D. Lin, D. Mocuta, N. Colleart, and A. V.-Y. Thean, “A Flexible InGaAs Nanomembrane PhotoFET with Tunable Responsivities in Near- & Short-Wave IR Region for Lightweight Imaging Applications”, APL Materials, February 2019
8. Y. Li, Y. Luo, S. Nayak, Z. Liu, O. Chichvarina, E. Zamburg, X. Zhang, Y. Liu, C. H. Heng, A. V.‐Y. Thean, A Stretchable-Hybrid Low-Power Monolithic ECG Patch with Microfluidic Liquid-Metal Interconnects and Stretchable Carbon-Black Nanocomposite Electrodes for Wearable Heart Monitoring, Advanced Electronic Materials, October 2019
9. Y. Li, Suryakanta Nayak, Yuxuan Luo, Yijie Liu, Hari Krishna Salia Vijay, Jieming Pan, Zhuangjian Liu, Chun Huat Heng, and Aaron Voon-Yew Thean, "A Soft PDMS-Liquid Metal Interdigitated Capacitor Sensor and Its Integration in a Flexible Hybrid System for On-Body Respiratory Sensing", Materials, 12 (9), 1458, 2019
10. Suryakanta Nayak, Yida Li, Willie Tay, Evgeny Zamburg, Devendra Singh, Chengkuo Lee, Soo Jin Adrian Koh, Patrick Chia, Aaron Voon-Yew Thean, "Liquid-Metal-Elastomer Foam for Moldable Multi-Functional Triboelectric Energy Harvesting and Force Sensing", Nano Energy, 64, 103912, 2019.
11. X. Feng, Y. Li, L. Wang, S. Chen, Z. G. Yu, W. C. Tan, N. Macadam, G. Hu, L. Huang, L. Chen, X. Gong, D. Chi, T. Hasan, A. V.-Y. Thean, Y.-W. Zhang, and K.-W. Ang, "A fully-printed flexible MoS2 memristive artificial synapse with femto joules switching energy," Advanced Electronic Materials 5, 1900740, 2019
12. X. Feng, Y. Li, Lin Wang, Zhi Gen Yu, Shuai Chen, Wee-Chong Tan, Nasiruddin Macadam, Guohua Hu, Xiao Gong, Tawfique Hasan, Yong-Wei Zhang, Aaron Voon-Yew Thean and Kah-Wee Ang, “First Demonstration of Fully-printed RRAM on Flexible Substrate Featuring Low Switch Voltage and its Application as Electronic Synapse”, Proceedings of VLSI, 2019
13. Hasita Veluri, Yida Li*, Maheswari Sivan, Jessie Xuhua Niu, Umesh Chand, Jin Feng Leong, Evgeny Zamburg, Subhranu Samanta, Xiao Gong, Kelvin Xuanyao Fong, and Aaron Voon-Yew Thean*, Novel Dot-Product Engine for Low-Voltage Analog Oxide ReRAM Array, SSDM proceedings, Osaka, 2019. *Corr-author
14. Y. Li et al, Aerosol Jet Printed WSe2 Based RRAM on Kapton Suitable for Flexible Monolithic Memory Integration, 2019 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), 2019
15. B. Xiong, Y. Li, Aaron Voon-Yew Thean, Chun-Huat Heng, A 7×7×2mm3 8.6-μW 500-kb/s Transmitter with Robust Injection-Locking Based Frequency-to-Amplitude Conversion Receiver Targeting for Implantable Applications, CICC Proceedings, 2019
16. Hari Krishna Salila Vijayalal Mohan, Wai Kit Chee, Yida Li, Suryakanta Nayak, Chueh Loo Poh, Aaron Voon Yew Thean, "A highly sensitive graphene oxide based label-free capacitive aptasensor for vanilin detection", Materials & Design, 2019
17. Y. Luo, Y. Li, A. V.-Y. Thean and C.-H. Heng, An 8.2-μW 0.14-mm2 16-Channel CDMA-Like Capacitance-to-Digital Converter, Journal of Solid-State Circuits, IEEE Journal of Solid-State Circuits. PP. 1-13., 2019, DOI:10.1109/JSSC.2019.2949232.
18. Y. Li, A. Alian, L. Huang, K. W. Ang, D. Lin, D. Mocuta, N. Collaert, and A V-Y Thean, A Near- & Short-Wave IR Tunable InGaAs Nanomembrane PhotoFET on Flexible Substrate for Lightweight and Wide-Angle Imaging Applications, 2018 Symposium on VLSI Technology, Honolulu, USA, Jun. 18-22, 2018
19. Li, Rongqiang; Guo, Yong-Xin; Chen, Wei; Li, Yida; Aaron, Thean Voon Yew, “A Flexible Liquid-Metal Alloy Bandpass Filter”, International Journal of RF and Microwave Computer-Aided Engineering, 28(5), Feb 2018
20. W. Chen, Y. Li, R. Li, A. V.-Y. Thean, and Y.-X. Guo, “Bendable and Stretchable Microfluidic Liquid Metal Based Filter With Stable Filtering Performance”, IEEE Microwave and Wireless Components Letters 28 (3), 203-205, 2018
21. W. S. Leong, X. Luo, Y. Li*, K. H. Khoo, S. Y. Quek, and T. L. Thong, “Low Resistance Metal Contacts to MoS2 Devices with Nickel-Etched-Graphene Electrodes”, ACS Nano, 9 (1), pp 869–877, 2015. *co-first
22. W.S. Leong, Y. Li*, X. Luo, C. T. Nai, S. Y. Quek and T. L. Thong, “Tuning the threshold voltage of MoS2 field-effect transistors via surface treatment”, Nanoscale, 7, 10823-10831, 2015. *co-first
23. Y. Li, K. Buddharaju, S. J. Lee, and T. L. Thong, “Suppression of Void Formation in Si0.5Ge0.5 Alloy Nanowire during Ni Germanosilicidation”, Advanced Engineering Materials, 16 (8), pp. 1032–1037, 2014
24. Y. Li, K. Buddharaju, N. Singh, G. Q. Lo, and S.J Lee, “Chip-Level Thermoelectric Power Generators based on High Density Silicon Nanowire Array Prepared with Top-down CMOS Technology”, IEEE Electron Device Letter, 32 (5), May 2011
25. Y. Li, K. Buddharaju, N. Singh, and S.J Lee, “Improved Vertical Silicon Nanowire based Thermoelectric Power Generator with Polyimide Filling”, IEEE Electron Device Letter 33 (5), March 2012