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Heterogeneous 3D ICs: Benefits, Challenges, and Future Prospects :

2019-05-10学术讲座

Academic Frontier Lecture No. 012

TIME: May 13th 14:00-15:00

VENUE: Taizhou Hall   Room202-2

SPEAKER: Sung Kyu Lim, Dan Fielder Professor, Georgia Institute of Technology

HOST: Prof. Hao Yu


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INTRODUCTION


Prof. Sung Kyu Lim received the B.S., M.S., and Ph.D. degrees from the University of California, Los Angeles in 1994, 1997, and 2000, respectively. He joined the School of Electrical and Computer Engineering, Georgia Institute of Technology in 2001, where he currently holds the Dan Fielder endowed chair professorship. His research focus is on the architecture, circuit design, and physical design automation for 3D ICs. His research on 3D IC reliability is featured as Research Highlight in the Communication of the ACM (2014). Dr. Lim received the NSF CAREER Award in 2006. He received several Best Paper Awards from ACM and IEEE conferences and has published more than 300 papers on 3D ICs. 


ABSTRACT


3D IC commercialization is at its full swing. Today we find 3D flash memory products fast-replacing 2D flash, DRAM cubes sitting next to GPUs, and camera modules with image sensors and memory vertically stacked. The holy grail of 3D IC technology lies in heterogeneous products, where cores, memory, accelerators, and other heterogenous components are partitioned and stacked to form a single IC. This heterogenous 3D IC offers unprecedented boost in memory bandwidth and PPA (power, performance, area) benefits for both cloud and edge computing applications. Lately, commercial activities are also growing in logic 3D ICs, where TSMC and Intel recently debuted their Wafer-on-Wafer and Foveros technologies respectively to target logic-on-memory and logic-on-logic applications. In this talk, we present our latest research accomplishments targeting heterogenous 3D ICs. We focus on design and CAD solutions developed to maximize PPA benefits while coping with manufacturing imperfections in heterogenous 3D ICs.


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