School of Microelectronics and Shennan Circuit Co., Ltd. Held A Strategic Cooperation Agreement Signing Ceremony

2020-09-04 General News views：8775

In the afternoon of September 4, School of Microelectronics and Shennan Circuits held a strategic cooperation agreement signing ceremony. Yang Zhicheng, Chairman of Shennan Circuit Co., Ltd. and Tianxin Internet Technology, and Yu Hongyu, President of School of Microelectronics, attended the signing ceremony. The ceremony was presided over by Associate Professor Ye Huaiyu.The candidates are all excellent and outstanding.

Speech by Yu Hongyu

President Yu Hongyu extended a warm welcome to Chairman Yang Zhicheng and his party. He said that Shennan Circuits is a leader in the domestic printed-circuit board industry, a pioneer in the domestic packaging substrate business, and an excellent enterprise of electronic assembly. The subsidiary Tianxin Internet Technology has a good technical foundation in the fields of system-level packaging, three-dimensional packaging, and heterogeneous integration. School of Microelectronics has gathered a group of outstanding experts and scholars in the fields of packaging design, manufacturing, materials, and technology, and has strong scientific research capabilities. It is hoped that the two parties will work together, concentrate their strengths, and strive to achieve major breakthroughs in the aspects of cutting-edge technologies of advanced packaging and the application of integration technologies to make outstanding contributions to the sustainable development of the packaging industry.

Speech by Yang Zhicheng

Chairman Yang Zhicheng briefly introduced the development of Shennan Circuit. He said that Shennan Circuits has grasped the historic opportunity of the rapid development of the electronics industry in China. Guided by customer orientation, and with technological development as the first driving force, the company has become a leading enterprise in printed circuit board industry of China after years of development. Tianxin Internet Technology is engaged in the orientation of semiconductor device module products. Although it has a certain foundation in technology platforms such as system-level packaging, advanced packaging and heterogeneous integration, it is in urgent need of cooperating with the School of Microelectronics and other scientific research institutions in universities to jointly establish a new R&D system combining production, teaching and research in order to make rapid breakthroughs in advanced packaging design, product design and other fields. He expected to give full play to the scientific and technological resource advantages of both parties in discipline talents, technology, equipment, and other aspects, carry out technology research and development focusing on major scientific problems and key common technologies, strive to break through the next generation of core technologies, accelerate the technical transformation, and ensure the win-win of both parties in the cooperation. He had high expectations for the smooth cooperation between both parties.

Signing Ceremony

Before the signing ceremony, Associate Professor Ye Huaiyu accompanied Yang Zhicheng and his party to visit the clean room of the Testing Center of Southern University of Science and Technology, the "Chip Technology" exhibition hall of the School of Microelectronics and the laboratories of various research orientations. At the signing ceremony, both parties reached a preliminary agreement of the cooperation in the fields of advanced packaging disciplines, school-enterprise joint research and development, school-enterprise joint training, and the joint construction of practice bases.

Group Photo